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How BT PCB technology promotes the progress of smart phones

    • 2108 posts
    January 19, 2021 12:20 PM EST
    PCB is a very important part of electrical appliances. From
    computers, home appliances to cars and robots, any device with
    electronic components has one or more built-in computer chips. Equipment
    manufacturers have been seeking to make their products smaller,
    lighter, and more complex to provide higher performance products,
    thereby improving product competitiveness. You may have a good example –
    smart phone technology has evolved with each new model, becoming
    lighter, more powerful and more powerful at the same time.To get more
    news about BT PCB, you can visit pcbmake official website.



    Chip manufacturers in these devices have been looking for ways to
    improve their chip technology to meet the needs of manufacturers for
    larger device functions. In order to improve the performance and make
    the equipment more portable, more parts need to be packed into the chip
    package. This is made possible by the use of a compact material that can
    reduce the spacing between traces on the substrate.



    Trace spacing is reduced from more than 100 microns to less than 20
    microns (1 micron is one thousandth of a millimeter). The biggest
    challenge in PCB production is to prevent deformation or bending caused
    by temperature changes. PCB manufacturing involves a process of
    alternating heat and cold, and the chip must be made of materials that
    maintain its shape under such conditions.



    The chip must also be able to maintain its performance specifications
    without compromising the performance of the chip throughout its life
    cycle through the expansion and contraction that occurs every time the
    device is turned on and off. BT resin is a “low warpage” material with
    high structural integrity and performs well in all aspects. Our BT resin
    is the key material in the chips running in today’s electronic
    equipment, and we will continue to develop and improve the capability of
    BT resin for future technology.



    Targeting chips with higher size substrate materials for AI and IOT,
    the future of information technology.Electronic technology is developing
    rapidly, and information technology is at the forefront of this
    revolution.



    Powerful mobile technologies like smart phones have become the
    standard, while wearable devices are just the beginning of the Internet
    of things (IOT) era and the arrival of artificial intelligence (AI) era.
    Each of these technologies represents the exponential growth of
    information processing capacity and complexity, which will require a
    great revolution in semiconductor technology.



    BT PCB is the key to make these technologies feasible. MGC is
    increasing the size of BT resin to a higher size. Looking forward to the
    future needs of chip manufacturers, we are conducting research and
    development to enhance the function of the substrate, which will lay the
    foundation for the next leap in information technology.